PerspectiveMicroelectronics

Flip the Chip

+ See all authors and affiliations

Science  22 Dec 2000:
Vol. 290, Issue 5500, pp. 2269-2270
DOI: 10.1126/science.290.5500.2269

You are currently viewing the summary.

View Full Text

Summary

As integrated circuit fabrication advances rapidly and the market for faster, lighter, smaller, yet less expensive electronic products accelerates, electronic packaging faces its own challenges. In this Perspective, Wong, Luo, and Zhang describe recent advances in flip chip packaging. This technology has many advantages over the conventional wire bonding technology and offers the possibility of low-cost electronic assembly for modern electronic products.

Related Content