Scattershot Patterning

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Science  17 Jun 2005:
Vol. 308, Issue 5729, pp. 1715
DOI: 10.1126/science.308.5729.1715b

Although many methods exist for the patterning of semi-conductor surfaces, for large-scale fabrication, a system that can self-assemble would be ideal. Recent work has shown that block copolymers are compatible with industrial silicon-based processing, thus these materials are attracting renewed interest.

Aizawa and Buriak have devised two methods to use block copolymers to direct reactions at semiconductor surfaces in a spatially defined manner. In the first approach, block copolymer micelles are loaded with reagents that react with the semiconductor surface on deposition. In the second, they can deposit a monolayer of self-assembling block copolymers onto a substrate, which is then immersed in the reactive reagent. This variation has the advantage of not limiting the reagent concentration to that available in the loaded micelles. The reactions studied were based on the galvanic reduction of oxidizing metal ions, which can bond to the substrates as particles, films, or other morphologies. The diblock copolymer consisted of polystyrene joined to poly-4-vinylpyridine (P4VP); the latter material is known to associate with metal ions or complexes. Thus, by controlling the location of the P4VP blocks, one can control the size and spacing of the metal particles. — MSL

J. Am. Chem. Soc. 10.1021/ja052281m (2005).

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