Materials Science

Faster ways to flexible electronics

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Science  05 Jun 2015:
Vol. 348, Issue 6239, pp. 1103
DOI: 10.1126/science.348.6239.1103-a

Semiconductor chips attached to a flexible, stretchable support

PHOTO: S.-C. PARK ET AL. ADVANCED MATERIALS (12 MAY 2015) © 2015 JOHN WILEY & SONS, INC.

Stretchable electronics that combine both inorganic and organic parts require processing methods compatible with both types of materials. Writing semiconductors directly onto flexible substrates is possible only at low temperatures. If one fabricates the semiconductors first, precise alignment steps are needed, including deposition of the interconnects. Park et al. developed a process of directed self-assembly where light-emitting diodes (LEDs) can be fluidically deposited onto a stretchable substrate, so that they bond to regions that are isolated from deformation. The bottom substrate contained regions of solder that directed the LED assembly. A top conductive layer was designed for rapid attachment without critical alignment. Thus, flexible solid-state lighting could be made in a continuous roll-to-roll process.

Adv. Mat. 10.1002/adma.201500839 (2015).

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