Research Article

Epidermal Electronics

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Science  12 Aug 2011:
Vol. 333, Issue 6044, pp. 838-843
DOI: 10.1126/science.1206157

Article Information

vol. 333 no. 6044 838-843

PubMed: 
Print ISSN: 
Online ISSN: 
History: 
  • Received for publication March 28, 2011
  • Accepted for publication June 10, 2011
  • .

Author Information

  1. Dae-Hyeong Kim1,*,
  2. Nanshu Lu1,*,
  3. Rui Ma2,*,
  4. Yun-Soung Kim1,
  5. Rak-Hwan Kim1,
  6. Shuodao Wang3,
  7. Jian Wu3,
  8. Sang Min Won1,
  9. Hu Tao4,
  10. Ahmad Islam1,
  11. Ki Jun Yu1,
  12. Tae-il Kim1,
  13. Raeed Chowdhury2,
  14. Ming Ying1,
  15. Lizhi Xu1,
  16. Ming Li3,6,
  17. Hyun-Joong Chung1,
  18. Hohyun Keum1,
  19. Martin McCormick2,
  20. Ping Liu5,
  21. Yong-Wei Zhang5,
  22. Fiorenzo G. Omenetto4,
  23. Yonggang Huang3,
  24. Todd Coleman2,
  25. John A. Rogers1,
  1. 1Department of Materials Science and Engineering, Beckman Institute for Advanced Science and Technology, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
  2. 2Department of Electrical and Computer Engineering, Coordinated Science Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
  3. 3Department of Mechanical Engineering and Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.
  4. 4Department of Biomedical Engineering, Tufts University, Medford, MA 02155, USA.
  5. 5Institute of High Performance Computing, 1 Fusionopolis Way, #16-16 Connexis, 138632, Singapore.
  6. 6State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, China.
  1. To whom correspondence should be addressed. E-mail: jrogers{at}uiuc.edu
  1. * These authors contributed equally to this work.

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