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Assembly of micro/nanomaterials into complex, three-dimensional architectures by compressive buckling

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Science  09 Jan 2015:
Vol. 347, Issue 6218, pp. 154-159
DOI: 10.1126/science.1260960

Article Information

vol. 347 no. 6218 154-159

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History: 
  • Received for publication September 8, 2014
  • Accepted for publication November 17, 2014
  • .

Author Information

  1. Sheng Xu1,*,
  2. Zheng Yan1,*,
  3. Kyung-In Jang1,
  4. Wen Huang2,
  5. Haoran Fu3,4,
  6. Jeonghyun Kim1,5,
  7. Zijun Wei1,
  8. Matthew Flavin1,
  9. Joselle McCracken6,
  10. Renhan Wang1,
  11. Adina Badea6,
  12. Yuhao Liu1,
  13. Dongqing Xiao6,
  14. Guoyan Zhou3,7,
  15. Jungwoo Lee1,5,
  16. Ha Uk Chung1,
  17. Huanyu Cheng1,3,
  18. Wen Ren6,
  19. Anthony Banks1,
  20. Xiuling Li2,
  21. Ungyu Paik5,
  22. Ralph G. Nuzzo1,6,
  23. Yonggang Huang3,,
  24. Yihui Zhang3,8,,
  25. John A. Rogers1,2,6,9,
  1. 1Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
  2. 2Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
  3. 3Department of Civil and Environmental Engineering and Department of Mechanical Engineering, Center for Engineering and Health, and Skin Disease Research Center, Northwestern University, Evanston, IL 60208, USA.
  4. 4Department of Civil Engineering and Architecture, Zhejiang University, Hangzhou 310058, P.R. China.
  5. 5Department of Materials Science and Engineering, Department of Energy Engineering, Hanyang University, Seoul 133-791, Republic of Korea.
  6. 6Department of Chemistry, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
  7. 7Key Laboratory of Pressure Systems and Safety (MOE), School of Mechanical and Power Engineering, East China University of Science and Technology, Shanghai 200237, P.R. China.
  8. 8Center for Mechanics and Materials, Tsinghua University, Beijing 100084, P.R. China.
  9. 9Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.
  1. Corresponding author. E-mail: jrogers{at}illinois.edu (J.A.R.); y-huang{at}northwestern.edu (Y.H.); yihui.zhang2011{at}gmail.com (Y.Z.)
  1. * These authors contributed equally to this work.

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