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Nanocrystalline copper films are never flat

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Science  28 Jul 2017:
Vol. 357, Issue 6349, pp. 397-400
DOI: 10.1126/science.aan4797

Article Information

vol. 357 no. 6349 397-400

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History: 
  • Received for publication April 20, 2017
  • Accepted for publication June 21, 2017
  • .

Author Information

  1. Xiaopu Zhang1,
  2. Jian Han2,
  3. John J. Plombon3,
  4. Adrian P. Sutton4,
  5. David J. Srolovitz2,5,
  6. John J. Boland1,*
  1. 1School of Chemistry, Centre for Research on Adaptive Nanostructures and Nanodevices (CRANN) and Advanced Materials and Bioengineering Research (AMBER), Trinity College Dublin, Dublin 2, Ireland.
  2. 2Department of Materials Science and Engineering, University of Pennsylvania, Philadelphia, PA 19104, USA.
  3. 3Components Research, Intel Corporation, Hillsboro, OR 97124, USA.
  4. 4Department of Physics, Imperial College London, Exhibition Road, London SW7 2AZ, UK.
  5. 5Department of Mechanical Engineering and Applied Mechanics, University of Pennsylvania, Philadelphia, PA 19104, USA.
  1. *Corresponding author. Email: jboland{at}tcd.ie

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