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Controlled crack propagation for atomic precision handling of wafer-scale two-dimensional materials

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Science  09 Nov 2018:
Vol. 362, Issue 6415, pp. 665-670
DOI: 10.1126/science.aat8126

Article Information

vol. 362 no. 6415 665-670

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History: 
  • Received for publication April 7, 2018
  • Resubmitted August 11, 2018
  • Accepted for publication September 21, 2018
  • .

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Author Information

  1. Jaewoo Shim1,2,*,
  2. Sang-Hoon Bae1,2,*,
  3. Wei Kong1,2,*,
  4. Doyoon Lee1,2,*,
  5. Kuan Qiao1,2,
  6. Daniel Nezich3,
  7. Yong Ju Park4,
  8. Ruike Zhao1,5,
  9. Suresh Sundaram6,
  10. Xin Li6,
  11. Hanwool Yeon1,2,
  12. Chanyeol Choi1,2,
  13. Hyun Kum1,2,
  14. Ruoyu Yue7,
  15. Guanyu Zhou7,
  16. Yunbo Ou8,
  17. Kyusang Lee1,2,9,
  18. Jagadeesh Moodera8,
  19. Xuanhe Zhao1,
  20. Jong-Hyun Ahn4,
  21. Christopher Hinkle7,10,
  22. Abdallah Ougazzaden6,
  23. Jeehwan Kim1,2,11,12,
  1. 1Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.
  2. 2Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA.
  3. 3Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, MA, USA.
  4. 4School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea.
  5. 5Department of Mechanical and Aerospace Engineering, The Ohio State University, Columbus, OH, USA.
  6. 6School of Electrical and Computer Engineering, Georgia Institute of Technology, UMI 2958 GT-CNRS, GT-Lorraine, Metz, France.
  7. 7Department of Materials Science and Engineering, University of Texas at Dallas, Richardson, TX, USA.
  8. 8Department of Physics, and Plasma Science and Fusion Center, Massachusetts Institute of Technology, Cambridge, MA, USA.
  9. 9Departments of Electrical and Computer Engineering and Materials Science Engineering, University of Virginia, Charlottesville, VA, USA.
  10. 10Department of Electrical Engineering, University of Notre Dame, Notre Dame, IN, USA.
  11. 11Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.
  12. 12Microsystem Technology Laboratory, Massachusetts Institute of Technology, Cambridge, MA, USA.
  1. Corresponding author. Email: jeehwan{at}mit.edu
  1. * These authors contributed equally to this work.

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