PerspectiveThermal Transport

Nonresistive heat transport by collective phonon flow

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Science  26 Apr 2019:
Vol. 364, Issue 6438, pp. 332-333
DOI: 10.1126/science.aax2319

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Summary

Dissipating high-density heat is a major technological challenge, both on the small scale of computer chips and the large scale of industrial processes such as nuclear reactors. One way to meet this challenge is the use of microscopic mechanisms to model and design solid-state materials for efficient transport of high heat loads. Recent experiments confirmed theoretical predictions of unusual high thermal conductivity in semiconducting boron arsenide (BAs) (13). On page 375 of this issue, Huberman et al. (4) demonstrate extraordinary collective phonon transport that underlies the record-high thermal conductivity in graphite. These insights may help to design future methods for efficient heat dissipation.

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